603 Hardware Specifications, REV 2 5
Preliminary—Subject to Change without Notice
Table 3 provides the DC electrical characteristics for the 603.
Table 4 provides the power dissipation for the 603.
Table 3. DC Electrical Specifications
Vdd = 3.3
±
5% V dc, GND = 0 V dc, 0
≤
T
j
≤
105
°
C
Characteristic Symbol Min Max Unit
Input high voltage (all inputs except SYSCLK) V
IH
2.2 5.5 V
Input low voltage (all inputs except SYSCLK) V
IL
GND 0.8 V
SYSCLK input high voltage CV
IH
2.4 5.5 V
SYSCLK input low voltage CV
IL
GND 0.4 V
Input leakage current, V
in
= 3.465 V
1
V
in
= 5.5 V
1
I
in
—10
µ
A
I
in
— TBD
µ
A
Hi-Z (off-state) leakage current, V
in
=
3.465 V
1
V
in
=
5.5
V
1
I
TSI
—10
µ
A
I
TSI
— TBD
µ
A
Output high voltage, I
OH
= –9
mA V
OH
2.4 — V
Output low voltage, I
OL
=
14
mA V
OL
— 0.4 V
Capacitance, V
in
=
0 V, f = 1 MHz
2
(excludes TS
, ABB,
DBB
, and ARTRY)
C
in
— 10.0 pF
Capacitance, V
in
=
0 V, f = 1 MHz
2
(for TS
, ABB, DBB, and
AR
TRY)
C
in
— 15.0 pF
Notes
: 1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK, and JTAG signals). For detailed
leakage information, please contact your local Motorola or IBM sales office.
2. Capacitance is periodically sampled rather than 100% tested.
Table 4. Power Dissipation
Vdd = 3.3
±
5% V dc, GND = 0 V dc, 0
≤
T
j
≤
105
°
C
CPU Clock:
SYSCLK
Bus Frequency (SYSCLK)
Unit
25 MHz 33 MHz 40 MHz 50 MHz 66 MHz
Full-On Mode
Typical
1:1
Max.
1.8 W
2.5 W
Typical
2:1
Max.
1.8 2.0 W
2.5 2.9 W
Doze Mode
1
1:1 Typical
740 mW
2:1 Typical
745 800 mW
