603 Hardware Specifications, REV 2 29
Preliminary—Subject to Change without Notice
Clean after reflow De-ionized (D.I.) water if water-soluble paste is used
•Cleaner requirements—conveyorized, in-line
•Minimum of four washing chambers
—Pre-clean chamber: top and bottom sprays, minimum top-side
pressure of 25 psig, water temperature of 70 °C minimum, dwell
time of 24 seconds minimum, water is not re-used, water flow rate
of 30 liters/minute.
—Wash chamber #1: top and bottom sprays, minimum top-side
pressure of 48 psig, minimum bottom-side pressure of 44 psig,
water temperature of 62.5 °C (±2.5 °C), dwell time of 48 seconds
minimum, water flow rate of 350 liters/minute.
—Wash chamber #2: top and bottom sprays, minimum top-side
pressure of 32 psig, minimum bottom-side pressure of 28 psig,
water temperature of 72.5 °C (±2.5 °C), dwell time of 48 seconds
minimum, water flow rate of 325 liters/minute.
—Final rinse chamber: top and bottom sprays, minimum top-side
pressure of 25 psig, water temperature of 72.5 °C minimum, dwell
time of 24 seconds minimum, water flow rate of 30 liters/minute.
•No cleaning required if “no clean solder paste” is used
Touch-up and repair Water soluble (for example, Kester 450) or No Clean Flux
C4FP removal Hot air rework
C4FP replace Hand solder
